AAC plants, Hi-P and Casetek has announced its willingness to release the metal housing for future generations of the iPhone. It is reported by DigiTimes.
The Chinese company AAC Technologies, Singapore Hi-P Electronics and Casetek Taiwan is ready to fight for the right to produce parts of the housings of smartphones. AAC Technologies and Hi-P Electronics has already sent samples to Apple for quality control.
Hi-P and Casetek are already cooperating with the Corporation and strive to increase their presence. The Singapore plant manufactures the plastic cases for various gadgets, and the Taiwanese company makes the power button and volume controls, which are equipped with iPhone, iPad and MacBook.
These statements confirm the rumors that in the future you may receive the iPhone c 6.1-inch LCD screen and metal case. However, in this case, the gadget will not be able to support wireless charging. Perhaps the engineers and designers will develop in the rear panel of the hole, or make a paste of glass to a smartphone can be recharged remotely. If such hypotheses are confirmed, future iPhone will be different from the gadgets of its competitors on all sides.
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