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TSMC has outlined plans to use EUV lithography for the production of 5-nm processors

Mark Liu, CEO of TSMC, which supplies the processors for iPhone, iPad and iPod touch, told about the plans in the development of the 5-nm process.

TSMC hopes to develop the production of semiconductor products according to the norms of 5 nm by 2020. You plan to use lithography with the sources of hard ultraviolet radiation (EUV). According to Mark Liu at the end of the decade this technology will be able to make cost-effective in mass production.

An experimental platform for testing EUV-lithography promises to be a 7-nm process technology, which will allow to select optimal combination of equipment, masks and materials. The company believes that outperform their competitors in development of a new step of technological standards.

Now available to TSMC have four EUV scanners ASML NXE:3350 improved to 125 W with the radiation source. Two of the ASML scanner NXE:3400 EUV TSMC company will receive in the first quarter of 2017. Note for EUV projection manufacturer independently develops materials, photomask and methods of repairing the damage caused by hard radiation scanners.

In the first half of 2017 it is planned to launch pilot projects, and in early 2018, will start serial production of 7-nanometer chips.

As for the actual process, TSMC confirm the transfer of process technology with the norms of 10 nm from laboratories in the Department. The proceeds from the issue of 10-nm solutions, the company expects to see in the first quarter of 2017, with a gradual production growth to the end of the year. In TSMC noted that they have three digital project from customers using 10-nanometer of technological norms of production.

Question about slowing down the principle of “Moore’s law” TSMC’s leadership discussed philosophically. According to one of the heads of the company, TSMC gap in the introduction of 16-nm and 10-nm technology amounted to three years, and 7-nm technology, the transition will be done for the year. Two and a half years, which says Intel — quite an adequate term for doubling the density of transistors, according to TSMC.

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