iPhone 6s and iPhone 6s Plus, according to ChinaTimes, can get not just a new single-chip platform, and advanced SiP (System-in-Package). This decision Apple first started to use it for computing S1 in the “smart” watch Apple Watch.
Instead of the traditional solution PCB (printed circuit Board) for Apple smart watch has created the platform for SiP. System-in-Package includes everything needed for operation of the device components (sensors, graphics adapter, memory, etc.) in Other words, the Apple Watch is not the motherboard as usual, instead, the processor and the controllers are inside a single body. The company itself calls S1 “full computer on a chip”.
In smartphones SiP are not used in large development cost of this solution compared to the classical printed circuit boards. But this arrangement enables you to save more space, making the device more compact. It is known that Apple follows a strategy of changing their housing decisions every two years, so it’s unclear why the company would need to use SiP in future updates.
The new generation iPhone will be presented in autumn this year. In addition to the architecture of the Apple Watch, the wearable computer novelty borrow Force Touch technology, which allows the display device to recognize not only the clicked location, but strength. iPhone 6s will get a 12-megapixel camera and 2 GB of RAM LPDDR4.
