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iPhone 7 will be the first smartphone with a processor on the basis of technology InFO

TSMC is actively working on improvement of technological process InFO (Integrated Fan-Out), presented by the company in the first half of last year. According to Bernstein Research, the technology will first be used in the next generation of Apple smartphones.

In the middle of last month it became known that TSMC will become the exclusive supplier of processors for iPhone and iPad release, 2016. Such information, in particular, has expanded the portal DigiTimes citing Chinese publication Commercial Times.

It is known that TSMC will start mass production of chips A10, designed for the iPhone 7 in March next year. Earlier South Korea’s Samsung was involved in the supply of “rocks” for Apple, despite the fact that the vendors are direct competitors in the smartphone market. Now, according to some reports, TSMC will remain the only one in the list of providers.

The manufacturer will use a proprietary layout level substrate InFO (Integrated Fan-out) and 16-nm FinFET process, which is used in Apple’s A9 processor. The share of TSMC account for half of total production of this chip set in the recently-announced iPhone 6s and iPhone 6s Plus.

Technology Integrated Fan-Out will relieve the manufacturer from a number of problems with production of chipsets, allowing them to impose a logical matrix at each other, then install them directly on the circuit Board. And besides the obvious advantages of such a structure, it allows you to refuse the use of the substrate that reduces the thickness of PCB is 0.2 mm, and improves the dissipation of heat, increasing the performance of chipset, up to 20%.

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Till recently TSMC was not able to use this technology in mass production of chipsets because of too many marriage. But sources claim that the company was able to make significant progress and by the time the A10 chipset Apple will be able to reduce the rejection rate to a reasonable level. And Bernstein Research believe that Apple will be the first TSMC customer, who will receive the chipsets on the technology of InFO.

In one of his recent entries, which were at the disposal of the American financial publication Barron’s, analysts at Piper Jaffray assumed that in iPhone 7 Apple will decide to go for major design changes. The most interesting part of the forecast is the claim that “seven” will be devoid of the usual physical Home button.

The refusal of the Home button will give Apple the opportunity to beat the next generation iPhone theme “frameless” design.

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