Despite the fact that the announcement of a new iPhone expected in the autumn, rumors about smartphones have flooded the network. According to reports, Apple expects to make an iPhone 6s thinner and lighter due to the use of more compact led backlight module. This writes the Taiwanese trade publication Digitimes.
The dimensions of the chips of LED-lighting in the current iPhone 6 describes the expression 3.0 x 0.85 x 0.6 mm. For the next generation of smartphones, Apple has ordered more than miniature components. Through the use of advanced technologies, the developers managed to reduce their thickness by 0.2 mm For iPhone 6s chips are created based dimensions 3.0 x 0.85 x 0.4 mm.
The reduced dimensions of the components will allow Apple to reduce the thickness of the iPhone, said resource. Although not ruled out the likelihood that the company will retain the design of the device for filling storage space battery. The latter is more plausible – the company will have to change the form factor of a smartphone in order to slightly reduce the thickness of the device.
Earlier it was reported that one of the main changes in the iPhone 6s and iPhone 6s Plus will be a better camera. Apple will increase the resolution up to 12 megapixels and installs new RGBW sensor from Sony.
The main difference RGBW sensor is that in addition to the standard red, green and blue pixels it also uses white pixels. Adding a white sub-pixel improves the quality of images in low light conditions. It is also reported that the new camera will get increased speed AF.
The iPhone 6s is expected to be more capable and power-efficient Apple’s A9 processor built on 14 nm manufacturing process technology, 2 GB of RAM and a display with Force Touch technology. Official presentation of the new product is expected in September 2015.