Korean resource ETNews reported new details about the design of smartphones Apple new generation. The resource refers to the informed sources who had previously provided reliable information. According to this, the iPhone 7 will be even thinner than the current iPhone model.
Despite the fact that before the release of iPhone 7 is still six months, the network has already actively discussed features of the new flagship smartphone. According to sources, the smartphone will be applied a special technology of packaging an antenna and radio frequency module in a single chip, saving space inside the case. Apple engineers decided to use “fan-out” to build a wireless module that will allow to increase the number of terminals input/output (I/O) and display their output terminals without increasing the size of the chip.
Speaking about the iPhone 7, many analysts predict that the model will be the most thin and lightweight in history. So, last year KGI Securities analyst Ming-Chi Kuo suggested that the thickness of the device will vary between 6-6,5 mm will be almost the same as the sixth generation iPod touch (6.1 mm). But none of them still could not say what Apple will be able to reduce the thickness of their new flagships.
Thanks to “fan-out” Apple will have the opportunity to place more components in a single housing, thereby minimizing signal loss and reduce interference in a wireless connection. The antenna module and the RF chip will be integrated in a single chip on a circuit Board, not two as before, which will save space inside the case.
In addition, Apple intends to further protect the modules from electromagnetic radiation. If in the previous models of iPhone shielding was only used for protecting printed circuit boards and connectors, the iPhone 7 it will appear at the module Wi-Fi, Bluetooth, CPU, chip, and other cellular components.
Despite the fact that shielding seems to have only one advantage – protection against interference, theoretically the technology is capable of providing a number of other improvements. Reducing interference when receiving signals means that the quality of the wireless connection iPhone 7 will increase. In this case, the device does not have to use additional amplification of the signal, which, in turn, will positively affect battery life.
The publication noted that the use of technology “fan-out” and additional protection of the components from electromagnetic waves can lead to higher prices of components and the cost of manufacturing the iPhone 7. This ultimately may affect the final cost of the smartphone.
According to preliminary information the next generation iPhone will get dual camera, lose the plastic inserts antenna and 3.5 mm audio Jack used for headphones and speakers. In the hardware capabilities of the new series of smartphones will be Apple’s A10 processors.